High temperature, low profile white polyimide material (1 mil) with a permanent static dissipative adhesive and static dissipative release liner. Similar to B-718, but with a matte topcoat, which prevents solder balls from sticking after molten wave solder exposure. Surface resistivity values in the recommended range for dissipative ESD packaging materials. Also meets requirements of EIA-541 "Packaging Material Standards for ESD Sensitive Items".
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